| Abstrakt: |
The main purpose of the mathematical modeling presented in the article is to improve the quality of solid wood adhesive joints obtained on the basis of adhesives processed in an electric field. Since one of the main indicators of the quality of glued wood materials is the strength of the adhesive bond, the main subject of research was the process of forming strength during the curing process. The developed mathematical description makes it possible to consider in detail and take into account in technological practice the data hidden from experimental research, which are unattainable during the experiment. At the stage of theoretical research, the task was to create a mathematical model of the process of gluing wood with KFZH and KFMT glue when processing the glue with an electric field. The model would allow studying the dependence of the strength of the adhesive bond on the parameters of the technological process and, on the basis of this, optimize the technological process. It simulates the structure and physical properties of solids, liquids and gases, phase transformations, in particular, the processes of melting, crystallization, glass transition, evaporation and condensation. In the method of molecular dynamics, each microscopic particle (atom, ion, molecule, etc.) is considered as a geometric body of simple shape (ball, disk), moving in accordance with the laws of classical Newtonian dynamics and interacting with other particles as defined law. [ABSTRACT FROM AUTHOR] |
