| Autor: |
Lou, Tenggang, Wang, Lei, Kong, Xiangjian, Liu, Jine, Qin, Feng |
| Předmět: |
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| Zdroj: |
SID Symposium Digest of Technical Papers; Oct2022 Supplement S1, Vol. 53, p1074-1076, 3p |
| Abstrakt: |
LCD with ASG inside may encounter malfunction phenomenon after high temperature reliability analysis (RA). The main reason we found is the Vth shift. We reported the characterization method of how to design the ASG with wide operating temperature in the former article [1]. In order to quantify the Vth deterioration, we designed a 3.45inch panel with circular active area and ASG driven units. Among the ASG units, one of the ASG unit was designed that can test TFT Id‐Vg. The test pads were designed on the CFOG side. We tested the Id‐Vg curves of each TFT before and after 85°C high temperature operation reliability analysis. We analyzed the Vth shift of each TFT and discussed the result. The mechanization of the reset circuit deterioration and the solutions to achieving high temperature reliability test are summed in the discussion. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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