Liquid/Solid Interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu Dissimilar Joints during Soldering at Low Temperature by In-Situ Synchrotron Imaging.

Autor: Ramli, M. I. I., Salleh, M. A. A. Mohd, Nishimura, T., Yasuda, H., Zaimi, N. S. Mohamad, Nogita, K.
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Zdroj: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jul2022, Vol. 74 Issue 7, p2760-2769, 10p
Abstrakt: This paper investigates the solid-liquid-solid interaction between a low-temperature eutectic Sn-58Bi and Sn-3.0Ag-0.5Cu solder alloy during soldering. The effect of reflow temperature (below the melting of point of Sn-3.0Ag-0.5Cu) on the liquid/solid interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu mixed assemblies was investigated using an in-situ synchrotron imaging technique. The results show that, the dissolution rate of Sn from Sn-3.0Ag-0.5Cu into molten Sn-58Bi slowly increases with increasing reflow temperatures at 147°C, 157°C and 167°C and rapidly increases at 177°C and 187°C. At 147°C, 157°C and 167°C the dissolution ceased after 32.1 s, 27.5 s and 24.5 s respectively while at 177°C and 187°C the dissolution stopped at only 8.3 s. It is hypothesised the dissolution takes place until the liquid is saturated with respect to the Sn concentration which can be obtained from the solidus line in the Sn-Bi phase diagram. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index
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