Glass-molded optical interposers for wafer scale photonic integrated circuit packaging in 800G modules and co-packaged optics.
| Autor: | Ackermann, M., Shen, B., Merget, F., Wolz, M., Witzens, J. |
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| Zdroj: | Proceedings of SPIE; 12/5/2022, Vol. 12007, p120070M-120070M-11, 1p |
| Databáze: | Complementary Index |
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