Cutting-edge silicon-on-insulator substrate technology for datacenter transceivers and sensing applications.

Autor: Sciancalepore, Corrado, Wilmart, Q., Ecarnot, L., Herisson, D., Chabanne, G., Szelag, B., Alami-Idrissi, A.
Zdroj: Proceedings of SPIE; 12/3/2021, Vol. 12005, p1200502-1200502, 1p
Databáze: Complementary Index