| Abstrakt: |
Oil bleed from silicone dispensable thermal gap filler may adhere to the electronic components and causes contamination of device substrates. A highly crosslinked silicone dispensable thermal gap filler was fabricated as a two-part component. Oil bleed analysis was carried out on different commercially available coated substrates. The results suggest that the selection of filler type and multi-step mixing process could reduce oil bleed. Consequently, no oil bleed was observed for the entire dispensable thermal gap filler A (AO87AlN6), B (AO75AlN18) and C (AO62AlN31) on different coated substrates after 4 weeks. Part A and Part B component exhibit shear-thinning flow behavior with decreasing viscosity at high shear rates. Part A component of dispensable thermal gap filler C (AO62AlN31) shows maximum viscosity of 2460, 298, 56.8, and 0.318 Pa.s at 0.1, 1, 10, 100 shear rates, respectively and Part B component shows maximum viscosity of 128, 34.5, 14.4, 1.57 Pa.s at 0.1, 1, 10 and 100 shear rates, respectively. The cured dispensable thermal gap filler C (AO62AlN31) exhibits thermal conductivity, shore OO hardness, dielectric constant and dielectric loss of 3.7 W/m.K, 82.5, 7.233 (1 MHz) and 0.0108 (1 MHz), respectively. Hence, the fabricated composite C (AO62AlN31) can effectively dissipate heat in electronics packaging devices. [ABSTRACT FROM AUTHOR] |
