RF MEMS switch with double-clamp and wafer level package with through silicon vias for integration RF MEMS in applications 5G and internet of things.
| Autor: | Tkachenko, Alexey V., Lysenko, Igor E., Kovalev, Andrey V. |
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| Zdroj: | Proceedings of SPIE; 5/4/2022, Vol. 12157, p121570H-121570H-12, 1p |
| Databáze: | Complementary Index |
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