| Abstrakt: |
New polymer thermal interface materials (TIM) with high thermal conductivity values are very interesting for high-end microelectronics. Nevertheless, most polymer composite materials do not have desirable properties due to the isolating distribution of filler particles in the matrix. It is assumed that thermal greases with hybrid fillers can form a densely packed percolate structure, leading to considerable thermal conductivity enhancement. The results demonstrate that the addition of a second filler allows the thermal conductivity of the specimen and the volume fraction to increase, which provides the formation of various packaging types within composite material production. The highest thermal conductivity value, 3.02 W/(m K), is achieved for the grease AlN:C (1:2 mass ratio). The simulation and operational bench test of a CPU under thermal loads show a considerable working temperature decrease for AlN and AlN:Al (4:1 mass ratio) greases to 46°C and 47°C, respectively, 29.2% lower than for greases with a graphite or silicon carbide filler. [ABSTRACT FROM AUTHOR] |
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