Autor: |
Kim, Seho, Amirpour, Maedeh, Dharmakeerthi, Tharindu, Barsari, Vahid Zahiri, Covic, Grant, Bickerton, Simon, Thrimawithana, Duleepa |
Předmět: |
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Zdroj: |
IEEE Transactions on Industrial Electronics; Jan2022, Vol. 69 Issue 1, p314-322, 9p |
Abstrakt: |
In this article, coupled electromagnetic-thermal simulations of inductive power transfer (IPT) pads using finite-element simulations are discussed. Derivation of each electrical and thermal parameters required for the modeling process is outlined. Simulation models are used to predict the power loss and the temperature rise of an IPT pad at different ambient temperatures at steady state. Using these simulation methods, the power loss within an IPT pad operating at 50 ${^\circ }$ C ambient temperature is predicted. A 10-KW IPT system is set up within an environmental chamber to validate the predicted losses within the system. [ABSTRACT FROM AUTHOR] |
Databáze: |
Complementary Index |
Externí odkaz: |
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