| Autor: |
Shanidze, Lev V., Tarasov, Anton S., Rautskiy, Mikhail V., Zelenov, Fyodor V., Konovalov, Stepan O., Nemtsev, Ivan V., Voloshin, Alexander S., Tarasov, Ivan A., Baron, Filipp A., Volkov, Nikita V. |
| Předmět: |
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| Zdroj: |
Applied Sciences (2076-3417); Aug2021, Vol. 11 Issue 16, p7498, 11p |
| Abstrakt: |
Featured Application: High-frequency integrated circuits, heterogeneously integrated and hybrid RF circuits. We fabricated Cu-doped TiNxOy thin film resistors by using atomic layer deposition, optical lithography, dry etching, Ti/Cu/Ti/Au e-beam evaporation and lift-off processes. The results of the measurements of the resistance temperature dependence, non-linearity, S-parameters at 0.01–26 GHz and details of the breakdown mechanism under high-voltage stress are reported. The devices' sheet resistance is 220 ± 8 Ω/□ (480 ± 20 µΩ*cm); intrinsic resistance temperature coefficient (TCR) is ~400 ppm/°C in the T-range of 10–300 K; and S-parameters versus frequency are flat up to 2 GHz with maximum variation of 10% at 26 GHz. The resistors can sustain power and current densities up to ~5 kW*cm−2 and ~2 MA*cm−2, above which they switch to high-resistance state with the sheet resistance equal to ~200 kΩ/□ (~0.4 Ω*cm) caused by nitrogen and copper desorption from TiNxOy film. The Cu/Ti/TiNxOy contact is prone to ageing due to gradual titanium oxidation while the TiNxOy resistor body is stable. The resistors have strong potential for applications in high-frequency integrated and hybrid circuits that require small-footprint, medium-range resistors of 0.05–10 kΩ, with small TCR and high-power handling capability. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
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