| Autor: |
Li, Aiyuan, Wang, Qiusheng, Zou, Zhiming, Xiong, Peicheng, Wu, Zirong, Huang, Xingchen, Hong, Junbin, Chen, Wenjian |
| Předmět: |
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| Zdroj: |
SID Symposium Digest of Technical Papers; Aug2021 Supplement S1, Vol. 52, p968-969, 2p |
| Abstrakt: |
In this report we present our study on the assembly process of both the 8 inches substrate assembling as well as the single LCOS module. After the process parameter optimization, 6 um±0.3 um thickness variation were obtained for the 8 inches substrate which is suitable for the WSS based application. Assembly process of single LCOS with 5.8±0.1 um thickness was finally obtained with the optimized process. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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