Thermal conductivity analysis of a new sub-micron sized polystyrene foam.

Autor: Almeida, FA, Beyrichen, H, Dodamani, N, Caps, R, Müller, A, Oberhoffer, R
Předmět:
Zdroj: Journal of Cellular Plastics; Jul2021, Vol. 57 Issue 4, p493-515, 23p
Abstrakt: New polystyrene (PS) foams with submicron pore sizes and open pore structure are introduced as potential cores for vacuum insulation panels (VIPs). Measurements of the thermal conductivity λ of the air-filled and evacuated PS foams, the influence of temperature T, opacifiers as well as gas pressure p on the thermal conductivity λ are presented. First results of the foam microstructures, as visualized by electron microscopy, confirm that pore sizes below 1 µm can be achieved. Thermal conductivity values of advanced samples in vacuum of about 7 mW/(m·K) were measured. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index