| Autor: |
Arun Pillai, K. V., Hariharan, P., Krishna Murthy, R. |
| Zdroj: |
SILICON (1876990X); Jun2021, Vol. 13 Issue 6, p1827-1837, 11p |
| Abstrakt: |
Micro ED milling is one of the widely applied processes to generate microfeatures on electrically conductive materials. However, the drawbacks associated with this process namely low MRR and high surface roughness limits its wide applicability. To enhance the rate of metal removal and surface finish an investigation is carried out by mixing SiC nano powders with dielectric media. Experimental trails were conducted at different settings of discharge energy and powder concentration to identify the optimum condition for responses namely MRR, Ra and Micro hardness. Full factorial design is used to design the experiments for both plain dielectric and powder mixed µEDM process. The morphology of milled surface with plain /nano powder mixed dielectric has also been analyzed. The findings revealed that the break down voltage of SiC nano powder mixed dielectric was 40% lower than plain dielectric media due to this enhancement in MRR and surface finish. Lower values of powder concentration (2 g/l) favors the MRR and surface finish but the higher value of powder concentration (6 g/l) favors the microhardness. Crater size, voids and cracks were reduced with SiC mixed dielectric than plain dielectric under considered settings of discharge energy due to increase in sparking area. Material removal efficiency is found to be high with medium range of discharge energy for both plain and SiC mixed dielectric used. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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