Effect of ultrathin palladium layer in achieving a low temperature and pressure wafer level aluminum to aluminum bonding.
| Autor: | Cheemalamarri, Hemanth Kumar, Bonam, Satish, Vanjari, Siva Rama Krishna, Singh, Shiv Govind |
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| Zdroj: | Surface Topography: Metrology & Properties; Sep2020, Vol. 8 Issue 4, p1-13, 13p |
| Databáze: | Complementary Index |
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