| Autor: |
Leijtens, Xaveer, Santos, Rui, Williams, Kevin |
| Zdroj: |
IEEE Photonics Journal; Feb2021, Vol. 13 Issue 1, p1-15, 15p |
| Abstrakt: |
In this work we report the results of high density multi-channel optical multiprobes with pitches of 25 ${\mu }\rm{m}$ and 50 ${\mu }\rm{m}$ that provide edge-coupling used for on-wafer parallel testing of photonic integrated circuits. The probes are fabricated in an oxynitride platform and test demonstrations were carried out of edge-coupled indium-phosphide based photonic integrated circuits (PICs). Thirty-two optical parallel connections are simultaneously, passively aligned between the probe and the PIC by means of integrated guiding channels. The initial placement tolerance is more than 4 ${\mu }\rm{m}$ to give a passive alignment with an optical power variation of less than 1 dB. Multi-port loop-back optical power measurements are reported and the wavelength-dependent net modal gain of integrated semiconductor optical amplifiers was measured to further validate the concept. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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