The Magnetic Field-Assisted Assembly of Nanoscale Semiconductor Devices: A New Technique.

Autor:	Shet, Sudhakar, Mehta, Vishal R., Fiory, Anthony T., Lepselter, Martin P., Ravindra, N. M.
Předmět:	MAGNETIC fields NANOSTRUCTURED materials SEMICONDUCTOR wafers AIR pressure NANOTECHNOLOGY
Zdroj:	JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Oct2004, Vol. 56 Issue 10, p32-34, 3p, 2 Diagrams
Abstrakt:	Magnetic field-assisted assembly is an integration technique for the efficient placement of a large number of nanodevices into receptor sites etched in semiconductor wafers with or without circuitry. The diverging flux from a magnetic field source helps in attaching heterostructure nanodevices into wafers. Various approaches of magnetic field-assisted assembly using air pressure, vibration assistance, fluid, and feed tape are briefly explained in this article. Magnetic field-assisted assembly is anticipated to become a manufacturing approach that will be driven by its simplicity and promise of high yield at low cost. [ABSTRACT FROM AUTHOR]
Databáze:	Complementary Index
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