Compact InP spot‐size converter with vertically tapered core layer formed by micro‐loading effect.

Autor: Ueda, Y., Ogiso, Y., Kashio, N., Hashizume, Y., Kikuchi, N., Ishikawa, M., Kohtoku, M.
Zdroj: Electronics Letters (Wiley-Blackwell); Jun2017, Vol. 53 Issue 12, p797-799, 3p
Abstrakt: A compact (200 μm) spot‐size converter (SSC) with a vertically tapered core layer is developed, which is fabricated with a simple wafer process using the micro‐loading effect. It is confirmed that the vertical spot size of the SSC exceeded 2 μm, which was double that of the original waveguide. As a result, an InP waveguide integrated with the SSCs exhibited a coupling loss of <1 dB per facet for a lensed fibre with a 2.5 μm mode‐field diameter. The fluctuation in the total of coupling and excess losses of the SSC was <0.5 dB. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index