New Stepped Process and Materials for Chip Bonding Technology on Non-rigid and Flexible Substrates.
| Autor: | Park, Sung Kyu, Han, Jeong In, Kim, Won Keun, Kwak, Min Gi |
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| Zdroj: | MRS Online Proceedings Library; 2001, Vol. 682 Issue 1, p1-8, 8p |
| Databáze: | Complementary Index |
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