Analysis of Electromigration- and Stress-Induced Dynamical Response of Voids Confined in Metallic Thin Films.

Autor:	Gungor, M. Rauf, Cho, Jaeseol, Maroudas, Dimitrios
Zdroj:	MRS Online Proceedings Library; 2005, Vol. 899 Issue 1, p1-6, 6p
Databáze:	Complementary Index
Externí odkaz:	Zobrazit plný text záznamu Full text from SpringerLink