An Optimized 300 mm BCB Wafer Bonding Process for 3D Integration.
| Autor: | Singh, Pratibha, Hudnall, John, Qureshi, Jamal, Kamineni, Vimal Kumar, Taylor, Chris, Rudack, Andy, Diebold, Alain, Arkalgud, Sitaram |
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| Zdroj: | MRS Online Proceedings Library; 2010, Vol. 1249 Issue 1, p1-7, 7p |
| Databáze: | Complementary Index |
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