Effect of Dielectric Capping Layer on TDDB Lifetime of Cu Interconnects in SiOF.
| Autor: | Gambino, Jeff, Chen, Fen, Mongeon, Steve, Pokrinchak, Phil, He, John, Lee, Tom C., Shinosky, Mike, Mosher, Dave |
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| Zdroj: | MRS Online Proceedings Library; 2009, Vol. 1156 Issue 1, p1-6, 6p |
| Databáze: | Complementary Index |
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