| Autor: |
Ardalan, Shahab, Farjadrad, Ramin, Kuemerle, Mark, Poulton, Ken, Subramaniam, Suresh, Vinnakota, Bapiraju |
| Předmět: |
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| Zdroj: |
IEEE Micro; Jan/Feb2021, Vol. 41 Issue 1, p54-60, 7p |
| Abstrakt: |
Bunch of wires (BoW) is a new open die-to-die (D2D) interface that aims to gracefully tradeoff performance for design and packaging complexity across a wide range of process nodes. BoW performance can range from 320 Gb/s/mm with a simple design and packaging to 1+ Tb/s/mm with complex design and/or packaging. BoW directly enables heterogeneous integration, a primary advantage of chiplets. We discuss progress on BoW based on extensive design and performance studies by engineers from multiple companies. These studies aim to make BoW easy to use in a system. This open innovation project will deliver a low-complexity D2D interface with competitive power-performance metrics with the economies of scale for services and technologies associated with an open ecosystem. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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