Silicon Based System-in-Package : Breakthroughs in Miniaturization and 'Nano'-integration Supported by Very High Quality Passives and System Level Design Tools.

Autor: Murray, Franck, LeCornec, François, Bardy, Serge, Bunel, Catherine, Verhoeven, Jan, van den Heuvel, F. C. M., Klootwijk, J. H., Roozeboom, Fred
Zdroj: MRS Online Proceedings Library; 2006, Vol. 969 Issue 1, p1-10, 10p
Databáze: Complementary Index
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