Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum Interconnects.
Autor: | Zhang, G., Tan, C. M., Gan, Z. H., Prasad, K., Zhang, D. H. |
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Zdroj: | MRS Online Proceedings Library; 2003, Vol. 766 Issue 1, p1-6, 6p |
Databáze: | Complementary Index |
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