Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum Interconnects.

Autor:	Zhang, G., Tan, C. M., Gan, Z. H., Prasad, K., Zhang, D. H.
Zdroj:	MRS Online Proceedings Library; 2003, Vol. 766 Issue 1, p1-6, 6p
Databáze:	Complementary Index
Externí odkaz:	Zobrazit plný text záznamu Full text from SpringerLink