Evaluating Oxide Liner and Copper Barrier Integrity of Through-Silicon-Via by Electrical Characterization and Microanalysis.

Autor: Yu, Minrui, Bhushan, Bharat, Kumar, Niranjan, Park, Mun Kyu, Hua, John, Bolagond, Shwetha, Chan, Anthony C-T., Jin, Miao, Uritsky, Yuri, Toh, Chin-hock, Sundarrajan, Arvind, Dukovic, John, Ramaswami, Sesh
Zdroj: MRS Online Proceedings Library; 2013, Vol. 1559 Issue 1, p1-6, 6p
Databáze: Complementary Index
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