A Study on the Properties of Different IMP Ta, Ta(N) and Multi-Layer Ta/Ta(N) as Diffusion Barriers for Cu Metallization.
| Autor: | He, L., Li, C. Y., Zeng, Z. Q., Wu, J. J., Qian, Y., Zhang, Y., Liu, H. D., Xie, Joseph |
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| Zdroj: | MRS Online Proceedings Library; 2001, Vol. 714 Issue 1, p1-7, 7p |
| Databáze: | Complementary Index |
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