Reliability of Dielectric Barrier Films in Copper Damascene Applications.

Autor:	Lee, Albert S., Lakshmanan, Annamalai, Rajagopalan, Nagarajan, Cui, Zhenjiang, Le, Maggie, Xia, Li Qun, Kim, Bok Heon, M'Saad, Hichem
Zdroj:	MRS Online Proceedings Library; 2004, Vol. 812 Issue 1, p1-6, 6p
Databáze:	Complementary Index
Externí odkaz:	Zobrazit plný text záznamu Full text from SpringerLink