Integration of InGaN-based Optoelectronics with Dissimilar Substrates by Wafer Bonding and Laser Lift-off.
Autor: | Wong, William S., Kneissl, Michael, Treat, David W., Teepe, Mark, Miyashita, Naoko, Johnson, Noble M. |
---|---|
Zdroj: | MRS Online Proceedings Library; 2001, Vol. 681 Issue 1, p1-9, 9p |
Databáze: | Complementary Index |
Externí odkaz: |