Integration of InGaN-based Optoelectronics with Dissimilar Substrates by Wafer Bonding and Laser Lift-off.

Autor: Wong, William S., Kneissl, Michael, Treat, David W., Teepe, Mark, Miyashita, Naoko, Johnson, Noble M.
Zdroj: MRS Online Proceedings Library; 2001, Vol. 681 Issue 1, p1-9, 9p
Databáze: Complementary Index