Using a Barrier Layer to Inhibit Ti/Oxide Reaction to Reduce RC Delay and Improve Electromigration in Al-Cu/Ti/W Interconnect for High Power Analog and Mixed Signal Applications.

Autor: William, J. Murphy, Tom, C. Lee, Chapple-Sokol, Jonathan, Daniel, A. Delibac, He, Z. X., Stephen, E. Luce, Stephen, A. Mongeon, David, C. Thomas, Daniel, S. Vanslette, Timothy, D. Sullivan
Zdroj: MRS Online Proceedings Library; 2008, Vol. 1079 Issue 1, p1-7, 7p
Databáze: Complementary Index
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