High quality and high speed cutting of 4H-SiC JFET wafers including PCM structures by using Thermal Laser Separation.

Autor: Lewke, Dirk, Koitzsch, Matthias, Dohnke, Karl Otto, Schellenberger, Martin, Zuehlke, Hans-Ulrich, Rupp, Roland, Pfitzner, Lothar, Ryssel, Heiner
Zdroj: MRS Online Proceedings Library; 2014, Vol. 1693 Issue 1, p55-60, 6p
Databáze: Complementary Index
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