Influence of Voed Geometry on Electromigration Failure in Via-Line Structures.

Autor: Miner, B., Sriram, T. S., Pelillo, A., Bill, S. A.
Zdroj: MRS Online Proceedings Library; 1997, Vol. 473 Issue 1, p351-356, 6p
Databáze: Complementary Index
Externí odkaz: