| Autor: |
Jin, Yu, Fu, Dongzhi, Lee, Julong, Wang, Enlai, Lu, Yunlei, Xi, Wangfeng, Jiang, Jijun, Zhu, Yangjie, Zhao, Xuan, Liu, Bin |
| Předmět: |
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| Zdroj: |
Journal of the Society for Information Display; Oct2020, Vol. 28 Issue 10, p808-824, 17p |
| Abstrakt: |
In this work, we report a systematic investigation on Ag‐containing compound widely generated in anode wet etching process of low‐temperature polycrystalline Si active matrix organic light‐emitting diode (LTPS‐AMOLED). The formation mechanism of the aforementioned compound was proposed and confirmed by sufficient evidence. The relevant test results show that, unlike traditional metal compounds, this compound cannot be removed by aqueous oxalic acid solution. Furthermore, the reported Ag‐containing compounds grow and migrate in response to electric fields in high‐temperature and high‐humidity environment (85°C, 85% humidity) to short neighboring integrated circuit pads, causing severe product reliability failure. Spectra test results indicate that products with reliability failure are characterized by reduced display brightness and shifted color coordinates. To improve the reliability failure caused by Ag‐containing compounds, five potential schemes are presented, and most of them are conducted in this study. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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