| Autor: |
Ni, Tianming, Shu, Yue, Chang, Hao, Lu, Lin, Dai, Guangzhen, Zhu, Shidong, Qu, Chengming, Huang, Zhengfeng |
| Předmět: |
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| Zdroj: |
Journal of Circuits, Systems & Computers; Aug2020, Vol. 29 Issue 11, pN.PAG-N.PAG, 19p |
| Abstrakt: |
Due to the winding level of the thinned wafers and the surface roughness of silicon dies, the quality of through-silicon vias (TSVs) varies during the fabrication and bonding process. If one TSV exhibits a defect during its manufacturing process, the probability of multiple defects occurring in the TSVs neighboring increases the faulty TSVs (FTSV), i.e., the TSV defects tend to be clustered which significantly reduces the yield of three-dimensional integrated circuits (3D-ICs). To resolve the clustered TSV faults, router-based and ring-based redundant TSV (RTSV) architecture were proposed. However, the repair rate is low and the hardware overhead is high. In this paper, we propose a novel cross-cellular based RTSV architecture to utilize the area more efficiently as well as to maintain high yield. The simulation results show that the proposed architecture has higher repair rate as well as more cost-effective overhead, compared with router-based and ring-based methods. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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