Metallization of High Purity Al2O3 Substrate with Autocatalytic NiP Thin Films for Au Interconnection in MCM Packaging Technology.
| Autor: | Mederos, M., Flacker, A., Teixeira, R. C. |
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| Zdroj: | Journal of Integrated Circuits & Systems; 2020, Vol. 15 Issue 2, p1-4, 4p |
| Databáze: | Complementary Index |
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