| Autor: |
Gee-Kung Chang, Guidotti, Daniel, Fuhan Liu, Yin-Jung Chang, Zhaoran Huang, Sundaram, Venkatesh, Balaraman, Devarajan, Hegde, Shashikant, Tummala, Rao R. |
| Předmět: |
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| Zdroj: |
IEEE Transactions on Advanced Packaging; May2004, Vol. 27 Issue 2, p386-397, 12p |
| Abstrakt: |
In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first lime fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief gratings recorded by incoherent illumination, arrays of polymer micro lenses, and embedded bare die commercial p-i-n photodetectors. These embedded optical components are the essential building blocks toward a highly integrated SOP technology. The effort in this research demonstrates the potential for merging high-performance optical functions with traditional digital and radio frequency (RF) electronics onto large area and low-cost manufacturing methodologies for multifunction applications. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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