THE INFLUENCE OF ORGANIC BINDERS AND THEIR DECOMPOSITION PRODUCTS ON THE MICROSTRUCTURE AND THERMOELECTRIC PROPERTIES OF CONDUCTIVE MATERIALS BASED ON Si3N4 WITH TRANSITIONAL METAL CARBIDES ADDITIVES.
Autor: | Tsygoda, V., Kyrylenko, E., Petrovsky, V. |
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Zdroj: | Technology Audit & Production Reserves; 2020, Vol. 1 Issue 1(51), p11-18, 8p |
Databáze: | Complementary Index |
Externí odkaz: |