An Organosilicon Composition for Protection of Active Components of Electronic Products.

Autor: Neelova, O. V., Panova, T. A., Gazzaeva, R. A., Koblova, L. B.
Zdroj: Polymer Science -- Series D; Oct2019, Vol. 12 Issue 4, p345-350, 6p
Abstrakt: A two-component organosilicon composition was developed based on a solution of linear ladder organosilicon block copolymers containing linear polyorganosiloxane and ladder phenylsilsesquioxane units in an organic solvent and a curing agent, vinyl-tris-(acetoximo)silane. The composition can be used for the preparation of heat-resistant flexible and strong electroinsulating corrosion-passive coatings that serve to protect active components of micro- and radioelectronic products from effects of severe climatic factors. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index