| Autor: |
Alonso-del Pino, Maria, Jung-Kubiak, Cecile, Reck, Theodore, Lee, Choonsup, Chattopadhyay, Goutam |
| Zdroj: |
IEEE Microwave Magazine; Jan2020, Vol. 21 Issue 1, p18-34, 17p |
| Abstrakt: |
It is difficult to package and interconnect components and devices at millimeter-waves (mm-waves) due to excessive losses experiences at these frequencies using traditional techniques. The problem is multiplied manifold at terahertz (THz) frequencies. In this article, we review the current state of THz packaging and describe several novel techniques. As we will show, micromachined packaging is emerging as one of the best choices for developing advanced THz systems. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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