Temperature simulation of system-in-package produced with hybrid chip mounting technology.
| Autor: | Petr Boriskov, Natalya Ershova, Vadim Putrolaynen, Maxim Savitskii, Pavel Seredov, Alexei Soloviev |
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| Zdroj: | IOP Conference Series: Materials Science & Engineering; Oct2019, Vol. 630 Issue 1, p1-1, 1p |
| Databáze: | Complementary Index |
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