| Autor: |
Shaji, Athul, Sankaran, Krishnaswamy |
| Předmět: |
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| Zdroj: |
AIP Conference Proceedings; 2019, Vol. 2142 Issue 1, p110022-1-110022-5, 5p |
| Abstrakt: |
We study thermal integrity problem and design solutions for heat sinks used in electronic devices. We discuss modelling challenges using finite-element, finite-volume, and algebraic topological methods. We demonstrate the suitability of algebraic topological method for modelling multiphysics (electro-thermal) problems using the case of radiative and convective cooling in heat sinks. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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