| Autor: |
Ceccarelli, Lorenzo, Kotecha, Ramchandra M., Bahman, Amir Sajjad, Iannuzzo, Francesco, Mantooth, Homer Alan |
| Předmět: |
|
| Zdroj: |
IEEE Transactions on Power Electronics; Oct2019, Vol. 34 Issue 10, p9698-9708, 11p |
| Abstrakt: |
The reliability analysis and lifetime prediction for SiC-based power modules is crucial in order to fulfill the design specifications for next-generation power converters. This paper presents a fast mission-profile-based simulation strategy for a commercial 1.2-kV all-SiC power module used in a photovoltaic inverter topology. The approach relies on a fast condition-mapping simulation structure and the detailed electro-thermal modeling of the module topology and devices. Both parasitic electrical elements and thermal impedance network are extracted from the finite-element analysis of the module geometry. The use of operating conditions mapping and look-up tables enables the simulation of very long timescales in only a few minutes, preserving at the same time the accuracy of circuit-based simulations. The accumulated damage related to thermo-mechanical stress on the module is determined analytically, and a simple consumed lifetime calculation is performed for two different mission profiles and compared in different operating conditions. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
