| Autor: |
Lee, Byung-Jae, Noh, Ju-Young, Lee, Young-Shin, Min, Byung-Sam, Yang, Jun-Hyeok, Kim, Seung-Tae, Kim, Bum-Sik, Kang, In-Byeong |
| Předmět: |
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| Zdroj: |
SID Symposium Digest of Technical Papers; Jun2019, Vol. 50 Issue 1, p1433-1435, 3p |
| Abstrakt: |
The Proposed new T‐Con which packaged in one chip is made up of memory for compensation and OLED TV T‐Con ASIC die. In external compensation OLED TV system, the one chip packaged T‐Con enable to reduce T‐con Board area by 53%. Also experimental result shows that the proposed one packaged T‐Con improves the DDR timing margin by 15%. In heat generation measurement, it is equivalent to conventional 55" UHD OLED TV T‐Con that has been mass‐produced [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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