| Autor: |
Josell, D., Burkhard, C., Li, Y., Cheng, Y.-W., Keller, R.R., Witt, C.A., Kelley, D.R., Bonevich, J.E., Baker, B.C., Moffat, T.P. |
| Předmět: |
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| Zdroj: |
Journal of Applied Physics; 7/1/2004, Vol. 96 Issue 1, p759-768, 10p, 4 Black and White Photographs, 3 Diagrams, 2 Charts, 2 Graphs |
| Abstrakt: |
Electrical properties of damascene silver wires with widths between ≈60 and 840 nm and heights between ≈100 nm and 300 nm are presented. The superconformal electrodeposition process by which the seam-free and void-free metallizations were fabricated is summarized. The chemical-mechanical polishing plus oblique ion sputtering process by which metal overburden was removed from the field adjacent to the wires is detailed. The size-dependent resistivity of the wires is obtained and interpreted in terms of intrinsic resistivity, grain boundary reflection, and surface scattering. Quantitative analysis of the last is accomplished using a different implementation of the Fuchs-Sondheimer formalism for wires of rectangular geometry and nonzero surface specularity that is derived herein. © 2004 American Institute of Physics. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
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