Solution for the Drift Problem of the Chip in the Packaging Process.
| Autor: | Wang, Yansong, Dong, Shaohua, Liu, Yueyang, Jin, Rui, Leng, Guoqing, He, Feng, Liu, Jiang, Pan, Yan, Wu, Junmin |
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| Zdroj: | MATEC Web of Conferences; 11/19/2018, Vol. 232, pN.PAG-N.PAG, 4p |
| Databáze: | Complementary Index |
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