| Autor: |
Ding, Wei-Ying, Wei, Xing-Chang, Shu, Yu-Fei, Yi, Da, Xiang, Tie-Ming |
| Předmět: |
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| Zdroj: |
IEEE Transactions on Components, Packaging & Manufacturing Technology; Jun2018, Vol. 12 Issue 3, p1066-1072, 7p |
| Abstrakt: |
For the package or on-chip power distribution network (PDN) design, plane metals are usually adopted. In this paper, we propose a closed-form grid metals solution to calculate the inductance of such grid PDN for the frequencies below its first antiresonant frequency. First, the grid PDN is equivalent to a plane PDN based on the equivalent circuit of their unit cells. Furthermore, the equivalent plane PDN is simplified as an RLCG lumped circuit, where ${L}$ is the inductance of the grid PDN. Finally, the inductance of the grid PDN is obtained by the mode analysis of the equivalent plane PDN with a modified modal function. The proposed method is scalable, which can calculate the grid PDNs with the size from micrometer to centimeter. To verify the proposed method, a centimeter grid PDN is fabricated. The inductance obtained by the proposed method has a good agreement with that obtained by measurement and 3-D full-wave simulation. The proposed method can also be expanded to the case that the grid PDN has load impedances. In comparison with the numerical methods, the proposed method can give a more easy-to-understand explanation of the new antiresonant frequency produced by the load impedance. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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