| Autor: |
Mijalković, Slobodan, Nejim, Ahmed, Barquinha, Pedro, Scott, Ian |
| Předmět: |
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| Zdroj: |
SID Symposium Digest of Technical Papers; May2018, Vol. 49 Issue 1, p1905-1908, 4p |
| Abstrakt: |
A modeling methodology and design tools for mechanical deformation‐aware design of highly flexible wearable electronics are presented. A new 3D TCAD meshing tool is developed to explore the effects of bending on electrical characteristics of IGZO TFTs for e‐fiber applications. A generic meta‐modeling approach to extend the standard SPICE TFT models for mechanical deformation‐aware circuit simulation and design is proposed. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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