| Autor: |
Reit, Radu, Espinoza, Jesus, Vega, Abraham, Voutsas, Tolis, Avendaño-Bolívar, Adrian, Arreaga-Salas, David |
| Předmět: |
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| Zdroj: |
SID Symposium Digest of Technical Papers; May2018, Vol. 49 Issue 1, p1110-1112, 3p |
| Abstrakt: |
A new material, ATB, is demonstrated as a temporary bonding layer for a poly(amic acid)‐based, solution‐cast polyimide and Pylux‐MF, a polysulfide thermoset. Both films are deposited atop carriers coated with ATB and after device definition, are removed from the carriers using a 90° tensile peel with peel strengths below 10 cN/cm. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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