| Autor: |
Donovan, Brian F., Jensen, Wade A., Floro, Jerrold A., Hopkins, Patrick E., Chen, Long, Poon, S. Joseph, Giri, Ashutosh |
| Předmět: |
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| Zdroj: |
Applied Physics Letters; 5/21/2018, Vol. 112 Issue 21, pN.PAG-N.PAG, 5p, 1 Color Photograph, 2 Graphs |
| Abstrakt: |
We use aluminum nano-inclusions in silicon to demonstrate the dominance of elastic modulus mismatch induced scattering in phonon transport. We use time domain thermoreflectance to measure the thermal conductivity of thin films of silicon co-deposited with aluminum via molecular beam epitaxy resulting in a Si film with 10% clustered Al inclusions with nanoscale dimensions and a reduction in thermal conductivity of over an order of magnitude. We compare these results with well-known models in order to demonstrate that the reduction in the thermal transport is driven by elastic mismatch effects induced by aluminum in the system. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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