Line Roughness Improvements on Self-Aligned Quadruple Patterning by Wafer Stress Engineering.
| Autor: | Liu, Eric, Akiteru Ko, Biolsi, Peter, Soo Doo Chae, Chia-Yun Hsieh, Munehito Kagaya, Choongman Lee, Tsuyoshi Moriya, Shimpei Tsujikawa, Yusuke Suzuki, Kazuya Okubo, Kiyotaka Imai |
|---|---|
| Zdroj: | Proceedings of SPIE; 1/17/2018, Vol. 10589, p105890T-1-105890T-9, 9p, 2 Black and White Photographs, 3 Charts, 1 Graph |
| Databáze: | Complementary Index |
| Externí odkaz: |
|